Electroless UBM Formation Service｜Special Site of JX Metals

Introduction to application examples, advantages, and standard specifications of electroless UBM formation service

High-performance copper materials for connectors, FPCs, and so on

High-Purity Metals｜Special Site of JX Metals

Photocatalyst for Artificial Photosynthesis｜Special Site of JX Metals

Electroless UBM and solder bump [12, 17]

Rapid mechanochemical encapsulation of biocatalysts into robust metal–organic frameworks

Top 20 PCB laminate material suppliers in the world - IBE Electronics

Communications, Products and Services

Figure 1 from The impact of zincation on the electroless nickel UBM for low cost flip chip technology

WO2002036853A1 - Method for electroless nickel plating - Google Patents

The diffusion barrier effect of Fe-Ni UBM as compared to the commercial Cu UBM during high temperature storage - ScienceDirect

Simulation of current distribution in the solder bump: ͑ a ͒ Solder

Our Core Technologies Contributing to Societal Growth and Innovation｜JX Metals Corporation

Rutile Single Crystals （Furuuchi Chemical）｜Special Site of JX Metals

Development of lead-free interconnection materials in electronic industry during the past decades: Structure and properties - ScienceDirect