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Effect of die/substrate thickness ratio on Al pad stresses, under a

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Hollow CoP Encapsulated in an N-Doped Carbon Nanocage as an Efficient Bifunctional Electrocatalyst for Overall Water Splitting

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Low Temperature Cu-Cu Bonding Technology in 3D Integration: An Extensive Review

3D Reconstruction and Characterization of Polycrystalline Microstructures Using a FIB–SEM System

3D Reconstruction and Characterization of Polycrystalline Microstructures Using a FIB–SEM System

Impact of Nanosize on Supercapacitance: Study of 1D Nanorods and 2D Thin-Films of Nickel Oxide