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The module technology proposed in this paper is used to fabricate a wire embedded ethyl vinyl acetate (EVA) sheet module by applying a cell/module integrated process in which the cell and wire are bonded during the lamination process. A wire-embedded EVA sheet module was fabricated using a busbarless cell and SnBiAg wire. As a result of the module characteristics corresponding to the lamination process temperature, the highest efficiency of 19.55% was observed at 170 °C. The lowest contact resistivity between the wire and the finger electrode was shown under a temperature condition of 170 °C, which was confirmed to increase the efficiency owing to an improvement of the fill factor with an excellent electrical contact.
On analytical corrections for restraints in absolute binding free
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