Solder Bump Bonding, Ball Bumps and Wire Bonds
Solder Bump Bonding, Ball Bumping and Wire Bonding are first level interconnection methods used in microelectronic packaging
Bumps Vs. Hybrid Bonding For Advanced Packaging
PTI Blog wire bonder (2)
Scaling Bump Pitches In Advanced Packaging
An SEM image of a gold stud bump before (left) and after (right
GaAs Wafer Bumping
PTI Blog wire bonding materials (2)
Multipurpose Wire Bonding–Bumps, Wires, Combination Interconnects
PTI Blog ball-bumping process
PTI Blog gold ball bumping (2)
Solder Bump - an overview
Gold Stud Bumps in Flip-chip Applications
Understanding Wafer Bumping Packaging Technology - AnySilicon
Wire Bonding, a Way to Stitch Chips to PCBs - SK hynix Newsroom
Wafer Bumping Machines for Assembly Process Interconnections
Challenges Grow For Creating Smaller Bumps For Flip Chips