3-Pad LED Flip Chip COB by Flip Chip Opto — LED professional - LED Lighting Technology, Application Magazine

Wafer level packaging and flip chip design are the most recent trends in LED manufacturing and packaging. These LED types are perfectly suited for producing COB modules. This combination already promises better thermal performance than standard SMD package based products. However, there is still room for improvements. Pao Chen, Director of Research and Development at Flip Chip Opto shows how a 3-pad flip chip LED further reduces thermal resistance, allows higher power and can help to reduce costs.

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12V low voltage connection for safe use. Stable performance, easy to assemble and use. Consists of many LEDs for 7000lm high brightness and good

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